The NanoFocus μsprint hp-hsi can be used in the laboratory and in production control for the inspection of so-called micro bumps with very low pitches. Due to its high resolution and dynamics, height and diameter, co-planarity, and various other parameters can be measured within seconds, on wafers as well as on ceramics or plastic panels. The 3D inspection system allows measurements after the printing of the solder paste, after the reflow process, as well as after the coining. Additionally, the inspection of electro-plated bumps, so-called copper pillars, is possible.

Not only round bumps can be determined, the µsprint technology reliably measures rectangular pads or indentations.

Avoiding shadowing effects is another advantage of the confocal measurement principle in comparison to competing methods like laser triangulation or strip triangulation. High pillars with low pitch can be analyzed three-dimensionally with a simultaneous high aspect ratio.

The μsprint software, programmed according to SEMI standards, is equipped with special algorithms to determine bump positions, height and diameter even during data acquisition. The measured bumps are shown as good or reject parts in the die-grid. The areal analysis delivers very stable measurement results.

Recipe generation is possible with the measurement system online as well as offline. Recipes are adaptable to individual measurement tasks in only a few minutes. Automated wafer handling, reading of identification information, and measurement data transfer to statistics servers are standard features. The automatic alignment, the precision of the axes and the high resolution of the μsprint sensor lead to bump measurements with repeatability and accuracy in the nanometer range – all while maintaining highest measurement speed.