High resolution and measurement speed combined

NanoFocus presents new high speed sensor µsprint C3x

NanoFocus AG, developer and manufacturer of optical 3D surface metrology, presented the high speed sensor µsprint C3x at Control 2018 for the first time. It is the German metrology company´s latest version of the successful µsprint technology. In the process, the performance of the fastest confocal sensor already in existence could be increased by a multiple. The expert audience showed great interest in the new µsprint development, which has its application focus in electronics and semiconductor industry. 

In comparison to the µsprint C3 sensor, the new C3x sensor reaches a ten times higher axial resolution (10 nm), as well as a lateral resolution of 0,5 µm to 2,5 µm. Due to the high aperture objective, exclusively produced for NanoFocus´ µsprint product line by Zeis AG,  even steep angles up to 53° can be measured. This offers big advantages related to measurement data stability, especially in the field of bump inspection.

With the 256 channel system, more than 5 Mio. 3D measurement points are processed. For users this means an increase of the so far output by up to 80%, compared to µsprint C3. “The new µsprint C3x sensor´s performance shows that high resolution and measurement speed are combinable“, states Marcus Grigat, COO of NanoFocus AG. „Customer´s and trade show visitor´s great interest, as well as their exclusively positive feedback, confirm that we set the right development goals for our technology.”

The high speed sensor´s main application is the automated inspection of wafers, probe cards and MEMS. Especially for system integrators, NanoFocus offers an OEM version of µsprint C3x.